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Product specification
7
Chip Resistor Surface Mount
RT
SERIES
0402 to 2512 (RoHS Compliant)
10
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Temperature
TEST METHOD
IEC 60115-1 4.8
PROCEDURE
At +25/–55 °C and +25/+125 °C
REQUIREMENTS
Refer to table 2
Coefficient of
R 2 –R 1
Resistance
(T.C.R.)
Formula:
T.C.R= ------------------------- ×10 6 (ppm/°C)
R 1 (t 2 –t 1 )
Where
t 1 =+25 °C or specified room temperature
t 2 =–55 °C or +125 °C test temperature
R 1 =resistance at reference temperature in ohms
R 2 =resistance at test temperature in ohms
Life/Endurance
IEC 60115-1 4.25.1
At 70±5 °C for 1,000 hours, RCWV applied for
±(0.5%+0.05 ? )
1.5 hours on, 0.5 hour off, still air required
High
IEC 60068-2-2
1,000 hours at 155±5 °C, unpowered
±(0.5%+0.05 ? )
Temperature
Exposure/
Endurance at
Upper Category
Temperature
Moisture
Resistance
MIL-STD-202G Method-106G
Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
±(0.5%+0.05 ? )
65 °C 95% R.H, without steps 7a & 7b,
unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202G Method-107G
-55/+125 °C
Number of cycles required is 300. Devices
unmounted
±(0.5%+0.05 ? ) for 10 K ? to
10 M ?
±(0.5%+0.05 ? ) for others
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
Humidity
(steady state)
IEC 60115-1 4.37
Steady state for 1000 hours at 40 °C / 95% R.H.
RCWV applied for 1.5 hours on and
±(0.5%+0.05 ? )
0.5 hour off
www.yageo.com
Oct 21, 2009 V.4
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